ISO INTERNATIONAL 16413 STANDARD Second edition 2020-08 Evaluation of thickness, density and interface width of thin films by X-ray reflectometry Instrumental requirements, alignment and positioning, data collection, data analysis and reporting Evaluation de I'epaisseur, de la densite et de la largeur de Il'interface des films finsparreflectrometriede rayonsX-Exigences instrumentales, alignementet positionnement, rassemblementdes donnees, analysedes donnees et rapport Reference number IS016413:2020(E) ISO @IS02020 IS016413:2020(E) COPYRIGHTPROTECTEDDOCUMENT ISO2020 All rights reserved. Unless otherwise specified, or required in the context of its implementation, no part of this publication may below or ISo's member body in the country of the requester. ISO copyright office CP 40i : Ch. de Blandonnet 8 CH-1214 Vernier, Geneva Phone: +41 22 749 01 11 Email: [email protected] Website: www.iso.org Published in Switzerland ii IS02020-Allrights reserved IS016413:2020(E) Contents Page Foreword iv Introduction. V 1 Scope .1 2 Normativereferences .1 3 Terms and definitions. 1 3.1 Terms and definitions. 1 3.2 Symbols and abbreviated terms. 3 Instrumental requirements, alignment and positioning guidelines 4 4 4.1 Instrumental requirementsforthe scanning method 4 4.1.1 Schematic diagrams.. 4 4.1.2 IncidentbeamRequirementsandrecommendations 6 4.1.3 SpecimenRequirementsandrecommendations. 7 4.1.4 Goniometer-Requirements. 8 4.1.5 Detector- Requirements 8 4.2 Instrument alignment 9 4.3 Specimen alignment 9 .11 5 Data collection and storage 5.1 Preliminary remarks. 11 5.2 Data scan parameters. 11 5.3 Dynamic range.. 11 5.4 Step size (peak definition) 12 5.4.1 .12 Fixed intervals scan 5.4.2 12 Continuousscan 5.5 .12 Collectiontime (accumulated counts) 5.6 .12 Segmented data collection. 5.7 Reduction of noise. .13 5.8 .13 Detectors. 5.9 Environment 13 5.10 .13 Datastorage. 5.10.1 Data output format 13 5.10.2 Headers. 13 Data analysis. .14 6 6.1 Preliminary datatreatment. 14 6.2 Specimen modelling 14 6.2.1 General.. 14 6.2.2 Interface width models 15 6.3 Simulation ofXRRdata 16 6.4 General examples. 16 6.5 Data fitting 22 7 Information required when reporting XRR analysis .24 7.1 General. 24 7.2 Experimental details .24 7.3 Analysis (simulation andfitting) procedures .25 7.4 Methods for reporting XRR curves .26 7.4.1 Independentand dependentvariables .26 7.4.2 Graphical plotting of XRR data. .26 Annex A (informative) Example of report for an oxynitrided silicon wafer .29 Bibliography .32 @ IS0 2020 - All rights reserved iii